Job Information
Texas Instruments Applications Engineer in Shanghai, China
Description
We can't predict what the future holds, but we know Texas Instruments will have a part in shaping it.
As a member of FPD Link Applications team, will be responsible for successful integration of FPD Link solutions into customer end products in Automotive markets. Provide technical training to the company's field application engineers during the pre-sales process. Provide in-depth technical responses to customers and to the company's field application engineers during the pre-sales process. Once engaged with a customer, map out the technical details of system integration plan, from project start through mass production. Work closely with cross function teams in TI including Design engineering, product marketing and business development, program management, and peers in customer engineering organizations across multiple regions.
Responsibilities: As a member of FPD Link Applications team, will be responsible for successful integration of FPD Link solutions into customer end products in Automotive markets. Provide technical training to the company's field application engineers during the pre-sales process. Provide in-depth technical responses to customers and to the company's field application engineers during the pre-sales process. Once engaged with a customer, map out the technical details of system integration plan, from project start through mass production. Work closely with cross function teams in TI including Design engineering, product marketing and business development, program management, and peers in customer engineering organizations across multiple regions. Board level high speed circuit design related to Automotive FPD Link SerDes technology. Must have good lab skills using various instruments, such as Spectrum Analyzer, Logic Analyzer, VSA, Network Analyzer, and Oscilloscope. Hardware application engineering experience including managing customer technical issues, hardware design support, and customer facing documentation. Prior system integration experience with Digital Video or High-speed SerDes are recommended and knowledge in PCIe, SATA, 1000BASE-T1, or other high speed wired communications specifications is helpful. Must be able to proactively anticipate customer design issues and author white papers and application notes that address those issues. Must possess superior problem solving and board-level debug capabilities. Must be self-motivated with good written and verbal communication skills. Ability to provide system design feedback to IC and system development team. Ability to manage internal projects and coordinate with overseas field application engineers. Ability to proactively manage customer expectations to influence customer relation and design decisions is a plus
Qualifications
Minimum requirements
Bachelor’s degree in Electrical Engineering, ECE, or related field
3 years of relevant experience
Experience in applications support of analog products
Solid hardware and software debugging skills
Strong technical background, with the ability to produce high quality technical documentation
Preferred qualifications
Familiarity to high speed concepts
Demonstrated strong analytical and problem solving skills
Strong verbal and written communication skills
Ability to work in teams and collaborate effectively with people in different functions
Strong time management skills that enable on-time project delivery
Demonstrated ability to build strong, influential relationships
Ability to work effectively in a fast-paced and rapidly changing environment
Ability to take the initiative and drive for results
Board level high speed circuit design related to Automotive FPD Link SerDes technology. Must have good lab skills using
various instruments, such as Spectrum Analyzer, Logic Analyzer, VSA, Network Analyzer, and Oscilloscope.
Hardware application engineering experience including managing customer technical issues, hardware design support,
and customer facing documentation.
Prior system integration experience with Digital Video or High-speed SerDes are recommended and knowledge in PCIe,
SATA, 1000BASE-T1, or other high speed wired communications specifications is helpful.
Must be able to proactively anticipate customer design issues and author white papers and application notes that address
those issues.
Must possess superior problem solving and board-level debug capabilities.
Must be self-motivated with good written and verbal communication skills.
Ability to provide system design feedback to IC and system development team.
Ability to manage internal projects and coordinate with overseas field application engineers.
Ability to proactively manage customer expectations to influence customer relation and design decisions is a plus
Why TI?
Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
We’re different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.
About Texas Instruments
As a global semiconductor company, we design, manufacture, test and sell analog and embedded processing chips to nearly 100,000 customers. Our products enable electronics everywhere and in things you experience every day - from health care, smart homes and connected cars to drones, smart phones and more. Our passion to create a better and more sustainable world by making electronics more affordable through semiconductors drives us to make our technology smaller, more efficient, more reliable and more affordable.
Status Regular
Job: Engineering - Product Dev
Primary Location: CN-CN-Shanghai
Work Locations: Shanghai > China, Shanghai R&D Shanghai 201203
Req ID: 240001CP