Job Information
Micron Technology, Inc. Technician, Yield Enhancement in Boise, Idaho
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
This role performs technical tests and experiments for process of R&D engineering in the wafer fabrication area of semiconductor manufacturers and monitors, audits and provides guidance to line operators. You will process test runs and prepares records, charts, and graphs of results for presentation to engineering to identify yield problems or test new products.
Required equipment related responsibilities and required documentation:
• Log Equipment to the accurate state using ETI (Equipment tracking interface)
• Troubleshoot and attempt to resolve any equipment problem if possible
• If unable to resolve the issue then Log equipment down in ETI and interact directly with the equipment vendor FSE or the R&M group to resolve
• Sophisticated operational capabilities (including shut down / start up) for all SEM Lab platforms and related support equipment (NSC dry etcher, Manual Wet Hood, Oxford EDS)
Dual Beam operation:
• Can verify Dual Beam is running accurately and have a proven understanding:
beam alignments (ion aperture alignment verification), high/low KV, beam current, SE, lower detector, upper detector (TLD), contamination, sample cleaning
• Can complete typical high quality general and site specific (single bit) Dual Beam Slice and view targeting
o Plane view slice and view (Planar fib movie)
• Basic STEM performance
o High quality, repeatable general location STEM analysis (Bright and Dark Field)
•Intermediate STEM performance
o Specific Bit / Word targeting
o Inverted stem
•Validated capability to improve Ion beam alignments and save setting procedures
• Confirmed capability to perform Ion and Electron Beam voltage contrasting techniques
Required sample prep related knowledge and required documentation:
• Confirmed, reliable etchbacks / deprocessing to all commonly identified Failure Analysis levels on at least one(1) main running part type from Fab 4 R&D (MDM documentation required)
• Explain primary uses for sample specific CMP polish stations regarding PFA
• Explain uses and examples of Dry and Wet Etch delayering regarding PFA and of Ion Polish (Fischione) performance with regard to delayering
• Explain orientation (angle/rotational effects) and goal recognition with respect to Dual Beam sample loading
• Backside de-processing
• 4Wave de-processing
Required Failure Analysis Software Support programs and documentation:
• Cadence (K2 view/Klayout/DF2) file loading and operation to include:
o Confirmed zoom and pan functionality
o Masking layer addition and subtraction
• Klarity file loading and operation to include:
o Inline defect ID collection using optical solutions
o Dual Beam/SEM top down, angle, and x-sec view
• ESDA – Familiarity/recognition of commonly used Electrical Categories on at least one main running part type from Fab 4 R&D as taught by YE part type Engineering
Required Process related knowledge and documentation:
• Finish the process related classes offered by the Micron training department (primarily traveler classes) on all current technologies running in Fab4 (ie) DRAM, NAND, MTX, EM etc. (Micron training verification)
o Complete probe level x-sec with and ION polish and label primary x-sec levels on current assigned (at least one) part type/technology: (Update Document annually)
Customer service (Internal YE Eng) responsibilities:
• Effective and efficient communication with internal part type YE Engineering group including:
o Defect location (Kludge sheet) verification and confirmation
o Topography accuracy
o Failure mechanism verification
o Project (Eng passdown/Workflow) completion verification
Required SEM Lab Responsibilities:
• Finish the required Sem lab samples each shift and required will be determined by the current queue
• In Progress, Held, Fibs, Topdown Fischione will be removed from Total queue to current queue
• If there are a total of 9 sem tech/sem on shift, then no Sem lab will be required for that shift
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn about your right to work click here. (http://www.justice.gov/crt/worker-information)
To learn more about Micron, please visit micron.com/careers
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.